水平机械研磨酸性镀铜工艺研究

为研究不同研磨珠直径对镀层细化及性能的影响,在硫酸盐酸性镀铜溶液中添加玻璃珠,玻璃珠的运动对A3钢表面产生机械研磨作用(MA),并采用扫描电镜、显微硬度测试仪、电化学工作站等方法对其进行观察和分析.结果表明:与传统硫酸盐酸性镀铜层相比,机械研磨镀铜层的膜厚和孔隙率降低,硬度、耐蚀性、防渗碳性能提高;机械研磨镀铜层的晶粒尺寸大小随着研磨直径的增大先减小后增大;当研磨珠直径为8 mm时,镀层的晶粒尺寸小于2μm,硬度达到168.3 HV,孔隙率为0.6个/cm~2,渗碳层的厚度为40μm.

Process and properties of horizontal mechanical attrition copper electroplating in acid solution

To investigate the influence of different diameters of glass balls on the microstructure and properties of mechanical attrition electroplating, the movement of glass balls has mechanical attrition( MA) action effect on A3 steel in a traditional acidic copper plating with sulfate by adding glass balls. Scanning electron microscopic characterization ( SEM) , micro-hardness test and electrochemical experiments were performed in this research. The results showed that, compared to the traditional electroplated copper plating, the thickness and porosity of copper plating with MA were reduced, the hardness, corrosion resistant and the property of anti-carburizing of the copper plating were increased. With increase in the diameters of the glass balls, the grain size of copper plating with MA was first reduced and then increased. When the diameter of glass balls was 8 mm, the grain size of the copper plating was < 2 μm, the hardness was ~ 168.3 HV, the porosity was~ 0.6/cm2 and the thickness of carburized layer was 40 μm.