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热处理对卤化银多晶光纤显微结构的影响
引用本文:高建平,卞蓓亚,张议,武忠仁.热处理对卤化银多晶光纤显微结构的影响[J].无机材料学报,2000,15(5):787-790.
作者姓名:高建平  卞蓓亚  张议  武忠仁
作者单位:中国科学院上海硅酸盐研究所, 上海 200050
基金项目:八六三计划新材料领域资助!(715-001-0211)
摘    要:热挤压法成型的卤化银多晶光纤,经不同温度热处理后;光纤的显微结构发生了变化.扫描电镜形貌分析结果显示;热处理温度T≤170℃,显微结构未发生变化,晶粒尺寸1~2μm. T=200℃时,晶粒尺寸10~200μm; T=250℃时,晶粒尺寸20~30μm ;T=300℃时,晶粒尺寸30~40μm.光纤显微硬度测量结果也显示,热处理温度>170℃后,光纤的显微硬度随热处理温度的升高而降低,在200℃附近硬度降至最低值.

关 键 词:红外光纤  卤化银  热处理  显微结构  
收稿时间:1999-11-08
修稿时间:2000-01-29

Effect of Thermal Treatment on the Microstructure of Polycrystalline Silver Halide Fibers
GAO Jian-Ping,BIAN Bei-Ya,ZHANG Yi,WU Zhong-Ren.Effect of Thermal Treatment on the Microstructure of Polycrystalline Silver Halide Fibers[J].Journal of Inorganic Materials,2000,15(5):787-790.
Authors:GAO Jian-Ping  BIAN Bei-Ya  ZHANG Yi  WU Zhong-Ren
Affiliation:Shanghai Institute of Ceramics; Chinese Academy of Sciences; Shanghai 200050; China
Abstract:The silver halide fibers were made by hot extrusion. The microstructure of the fibers changed after thermal treatment at different temperatures. SEM micrographs showed that the microstructure of the fibers did not change when temperatures of thermal treatment T<170℃, and their grain sizes were 1~2μm. The grain size grew up when T>170℃. The relation of grain size and T was as follows: 10~20μm, T=200℃; 20~30μm, T=250℃; 30~40μm, T=300℃, respectively. The measurements of microhardness also showed that the microhardness of the fibers decreased as temperatures of thermal treatment increased when T>170℃ and the lowest microhardness appeared at 200℃.
Keywords:infrared optical fiber  silver halide  thermal treatment  microstructure
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