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Diffusion bonding of TiAl intermetallic and Ti3AlC2 ceramic: Interfacial microstructure and joining properties
Affiliation:1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;2. Shandong Provincial Key Laboratory of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China;1. National University of Science and Technology “MISIS”, SHS Research & Education Center MISIS-ISMAN, Leninsky Prospect, 4, Moscow 119049, Russia;2. Institute of Structural Macrokinetics and Materials Science, Russian Academy of Sciences, ul. Academica Osipyana, 8, Chernogolovka, Moscow Region 142432, Russia;1. Institute of Mathematics, Hunan University, Changsha, 410082, China;2. Institute for Mathematics and its Applications, School of Mathematics and Applied Statistics, University of Wollongong, Wollongong, NSW 2522, Australia;1. Institute of Material Science and Engineering, School of Mechanical and Electronic Control Engineering, Beijing Jiaotong University, Beijing 100044, China;2. Institut PPRIME, Département de Physique et Mécanique des Matériaux, CNRS, Université de Poitiers, ENSMA, UPR 3346, SP2MI, Téléport 2 Boulevard Marie et Pierre Curie, BP 30179, F86962 Futuroscope Chasseneuil Cedex, France;1. Department of Materials Science and Engineering, Texas A&M University, College Station, TX 77843, USA;2. School of Civil Engineering, University of Sydney, Sydney, NSW 2006, Australia
Abstract:TiAl intermetallics and Ti3AlC2 ceramics were jointed through diffusion bonding using Ti/Ni interlayer. The effect of bonding temperature and holding time on interfacial microstructure and mechanical properties of the bonded joints were investigated. The typical interfacial microstructure of the joint from TiAl to Ti3AlC2 side could be divided into τ3-Al3NiTi2, α2-Ti3Al, α-Ti + δ-Ti2Ni, δ-Ti2Ni, β2-TiNi, η-TiNi3, γ-(Ni)ss, γ′-Ni3(Al, Ti), γ′-Ni3(Al, Ti) + Ti3AlC2, respectively. The value of the microhardness in the reactive zones increased due to the formation of intermetallcs. Lower or higher bonding temperature and longer or shorter holding time both resulted in low strength owing to the insufficient diffusion of atoms or excessive formation of intermetallics. A high bonding strength can be obtained when bonding at 920 °C for 60 min. Fracture occurred through the intermetallic layer adjacent to the Ti3AlC2 substrate during shear test, showing brittle intergranular and transgranular characteristic.
Keywords:Intermetallic  Ceramic  Diffusion bonding  Microstructure  Mechanical
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