铜基表面复合材料的组织与弯曲变形

研究了铜合金表面镍基渗层的显微组织和铜基表面渗层的弯曲行为,结果表明：渗层包括表面烧结层、冶金熔合层和扩散固溶层,表面烧结层主要由镍基固溶体、CrB以及Cr3Ni2组成,冶金熔合层主要有镍基固溶体、CrB组成,扩散固溶层主要有镍基和铜基固溶体组成．在弯曲实验中,渗层分别位于试样的上部和下部,与基体的应力-应变曲线相比,表面带有渗层的试样的应力曲线上分别出现了屈服点和应力峰值,在相同应变条件下其弯曲强度分别比基体提高76％和32．9％,渗层的破坏为表面压溃剥离或产生裂纹,其破坏均发生在表面烧结层．

Microstructure and bending deformation about the surface composite materials on copper substrate

The microstructure of surface Ni-based infiltrated layer on copper substrate and the bending behavior were investigated.It was found the Ni-based infiltrated layer consist of surface sintering layer (SSL),metallurgical fusion layer (MFL) and diffusion solid solution layer (DSSL).The SSL is composed of"CrB,Cr_3Ni_2 and Ni-based solid solution,and the MFL is composed of CrB and Ni-based solid solution, while the Ni-based solid solution and Cu-based solid solution of high content are observed in DSSL.The Ni-based infiltration layer is located on the top or at the bottom of the sample in the bending experiment, respectively.There are yielding elongation point and peak value at the stress-strain curve comparing with that of the substrate,respectively.The bending strength is improved separately by 76% and 32.9% at the same strain comparing with the substrate.The SSL peeled off or cracked when the infiltrated layer failed.