| 短碳纤维-铜复合材料的研制 |
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| 引用本文： | 张晓君,应美芳,王成福.短碳纤维-铜复合材料的研制[J].材料研究学报,1990,4(3):223-227. |
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| 作者姓名： | 张晓君 应美芳 王成福 |
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| 作者单位： | 合肥工业大学
(张晓君，应美芳)，合肥工业大学(王成福) |
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| 基金项目： | 国家自然科学基金,58971036 |
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| 摘 要： | 研究了用粉未冶金方法制造短碳纤维-铜复合材料,对这种复合材料的力学性能及物理性能进行了测试,证明该复合材料中,碳纤维与铜基体间存在着界面结合。
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| 关 键 词： | 碳纤维 铜-碳复合材料 热导 电导 |
| 收稿时间： | 1990-06-25 |
| 修稿时间： | 1990-06-25 |
DEVELOPMENT OF SHORT CARBON FIBER-COPPER COMPOSITE |
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| ZHANG Xiaojun,YING Meifang,WANG Chengfu.DEVELOPMENT OF SHORT CARBON FIBER-COPPER COMPOSITE[J].Chinese Journal of Materials Research,1990,4(3):223-227. |
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| Authors: | ZHANG Xiaojun YING Meifang WANG Chengfu |
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| Affiliation: | Hefei University of Technology |
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| Abstract: | Short cabon fiber-copper composite were made by means of powder me-tallurgy.The fibers in composite were homgeneously distributed in the matrix and orientedrandomly.The tensile strength of the composite increases as the volume of fiber from 0 to2%,but decreases as the volume of fiber increases further.The thermal expansioncoefficient,thermal conductivity and electrical conductivity of the composite become smal-ler as the volume of fiber increases.While heating or cooling to reach certain temperature,the value of thermal expansion coefficiet,thermal conductivity and electrical conductivityremained almost the same.Interface bond exists between short carbon fiber and copper ma-trix. |
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| Keywords: | carbon fiber copper-carbon composite thermal conductivity electrical conductivity |
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