| 化学镀Ni-Sn-P中锡的析出行为 |
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| 引用本文： | 王鹤坤,刘鹤,贺岩峰.化学镀Ni-Sn-P中锡的析出行为[J].材料保护,2011,44(3):42-43,46,90. |
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| 作者姓名： | 王鹤坤 刘鹤 贺岩峰 |
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| 作者单位： | 长春工业大学化学工程学院,吉林,长春,130012 |
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| 摘 要： | 化学镀Ni-Sn-P层锡的含量对其性能有较大的影响,过去对锡的析出研究不多.为此,利用电子能谙(EDS)等方法分析了化学镀液中锡含量对镀速和镀层中锡、磷含量的影响,用扫描电镜(SEM)、电子能谱(EDS)对施镀不同时间的镀层形貌、组成进行了分析.结果表明:沉积速度随镀液中锡含量的增加而减小,镀层中的锡含量随着镀液中锡含...
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| 关 键 词： | 化学镀 Ni-Sn-P镀层 锡的析出 |
Deposition Behavior of Tin during Electroless Plating of Ni-Sn-P Coating |
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| WANG He-kun,LIU He,HE Yan-feng.Deposition Behavior of Tin during Electroless Plating of Ni-Sn-P Coating[J].Journal of Materials Protection,2011,44(3):42-43,46,90. |
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| Authors: | WANG He-kun LIU He HE Yan-feng |
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| Affiliation: | WANG He-kun,LIU He,HE Yan-feng(School of Chemical Engineering,Changchun Polytechnical University,Changchun 130012,China) |
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| Abstract: | The effect of Sn content in the bath on the deposition rate and composition of the coating was investigated.The morphology and composition of the coating were analyzed by means of scanning electron microscopy and energy dispersive spectrometry.Results show that the deposition rate decreases with increasing Sn content in the plating bath.The Sn content in the coating increased with the increase of Sn content in the bath,and P content in the coating decreased therewith.During the deposition of Ni-Sn-P coating... |
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| Keywords: | electroless plating Ni-Sn-P coating deposition of tin |
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