| 恒电位极化诱发钨铜合金化学镀镍磷的研究 |
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| 引用本文： | 杨超,甘复兴,沈伟. 恒电位极化诱发钨铜合金化学镀镍磷的研究[J]. 材料保护, 2006, 39(5): 4-6 |
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| 作者姓名： | 杨超 甘复兴 沈伟 |
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| 作者单位： | 武汉大学资源与环境科学学院环境工程系,湖北,武汉,430072;武汉大学资源与环境科学学院环境工程系,湖北,武汉,430072;中国科学院金属研究所,金属腐蚀与防护国家重点实验室,辽宁,沈阳,110015;武汉材料保护研究所,湖北,武汉,430030 |
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| 摘 要： | 使用自行研制的镀液配方,研究了在钨铜合金基体上化学镀镍磷的可行性.试验通过恒电位极化诱发法在NiSO4-H2PO2-体系中实现了钨铜合金表面的化学镀镍磷.对极化过程中基材表面的化学镀诱发机理进行了探讨,通过筛选试验确定了外加恒电位的大小和极化时间,并对镀层形貌和质量进行了检测.结果表明,镀层具有较好的结合力和耐蚀性.因此在钨铜合金上进行化学镀镍磷时,恒电位极化法是一种较好的诱发方法.
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| 关 键 词： | 钨铜合金 化学镀镍磷 恒电位极化 外观形貌 耐蚀性 |
| 文章编号： | 1001-1560（2006）05-0004-03 |
| 收稿时间： | 2005-12-25 |
| 修稿时间： | 2005-12-25 |
Study on Electroless Ni-P Plating on W-Cu Alloy Induced by Potentiostatic Polarization |
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| YANG Chao,GAN Fu-xing,SHEN Wei. Study on Electroless Ni-P Plating on W-Cu Alloy Induced by Potentiostatic Polarization[J]. Journal of Materials Protection, 2006, 39(5): 4-6 |
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| Authors: | YANG Chao GAN Fu-xing SHEN Wei |
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| Abstract: | The process of electroless Ni-P plating on W-Cu alloy in NiSO_4-H_2PO~-_2system induced by potentiostatic polarization was studied.The desired polarized potential and duration were determined based on screening test.Moreover,the morphology and surface quality of the target Ni-P alloy coating were analyzed as well.It was found that potentiostatic polarization could be readily used to facilitate the electroless plating of Ni-P on W-Cu alloy,and the target Ni-P coating had good adhesion to the substrate and good corrosion resistance as well. |
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| Keywords: | W-Cu alloy Ni-P electroless plating potentiostatic polarization surface morphology anti-corrosion behavior |
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