枪黑色Ni-Sn合金镀液的稳定性及金属杂质的影响

测定了以羟基羧酸盐作配体的电镀枪黑色Ni-Sn合金的碱性溶液各组分的自然消耗和生产性消耗，确定了镀液中能够抑制Sn^2 氧化的稳定剂，制定了清除镀液中Zn^2 、Fe^2 和Cu^2 等金属杂质的电解方法。结果表明，亚锡盐的自然消耗是引起镀液自然静置时不稳定的唯一因素，镀液生产性消耗，亚锡盐下降率最大，镍盐最小；以小电流电解可除Zn^2 、Fe^2 和Cu^2 杂质。

Stability of Gun-Color Ni-Sn Plating Bath and Effects of Metal Impurities

Cailiao Baohu 2001,34(3),25～ 26(Ch).The spontaneous and productive consuming of the components in alkaline bath solution for gun-color Ni-Sn plating when using hydroxy carboxy late as complex agent was studied.It was shown that the spontaneous consume of Sn2＋ could be the unique factor leading the bath solution unstable,and the Sn2＋ was reduced much more than Ni2＋ in productive consuming.The Zn2＋ ,Fe2＋ and Cu2＋ impurities could be moved out from the solution by electrolylic method.