新型环保型化学镀铜工艺

为了开发一种成本低廉、环境友好且镀层性能好的化学镀铜工艺，以草酸电解还原溶液为还原剂在A3钢表面进行化学镀铜。探讨了镀液组成、pH值及温度对镀铜速度、镀液稳定性及镀层附着力的影响。结果表明：最佳工艺为12～15g／L CuSO4，30～40g／LEDTA，10～20mg／L2，2’-联吡啶，10～12g／L乙醛酸＋5—...

Novel Environmentally Friendly Technology for Electroless Copper Plating

Electrolytic reduced solution of oxalic acid was used as a reducing agent to conduct electroless Cu plating of A3 steel.The effects of plating bath composition,pH value and temperature on the deposition rate,stability of plating bath,and adhesion to substrate of Cu coating were investigated.It was found that the optimized plating bath for electroless copper plating was composed of 12~15 g/L CuSO4,30~40 g/L EDTA,10~20 mg/L 2,2’-bipyridine,10~12 g/L glyoxylic acid and 5~7 g/L oxalic acid.The optimized pH value,temperature and time were determined to be 12,50 ℃ and 30 min respectively.As-plated Cu coating was uniform and bright,and had good adhesion to substrate.Under the optimized plating condition,the deposition rate reached 2.2 μm/h and the bath had good stability.