| 无染料酸性镀铜添加剂的发展状况 |
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| 引用本文： | 刘烈炜,张艳清,杨志强.无染料酸性镀铜添加剂的发展状况[J].材料保护,2006,39(6):38-40. |
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| 作者姓名： | 刘烈炜 张艳清 杨志强 |
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| 作者单位： | 1. 华中科技大学化学系,湖北,武汉,430063
2. 武汉材料保护研究所,湖北,武汉,430030 |
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| 摘 要： | 综述了无染料酸性镀铜添加剂MN系列的发展状况及几类无染料添加剂的优点和不足,比较了无染料系列添加剂与有机染料系列的性能差异,对目前最好的无染料添加剂系列EPI进行了简要的介绍,并展望了未来添加剂的发展方向.
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| 关 键 词： | 酸性镀铜 添加剂 无染料 综述 |
| 文章编号： | 1001-1560（2006）06-0038-03 |
| 收稿时间： | 2006-02-18 |
| 修稿时间： | 2006-02-18 |
Review on Current State of Additives for Non - Dye Acidic Copper Electroplating |
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| LIU Lie-wei,ZHANG Yan-qing,YANG Zhi-qiang.Review on Current State of Additives for Non - Dye Acidic Copper Electroplating[J].Journal of Materials Protection,2006,39(6):38-40. |
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| Authors: | LIU Lie-wei ZHANG Yan-qing YANG Zhi-qiang |
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| Abstract: | A review was given on the current state and development of MN series additives for non-dye acidic copper electroplating.The advantages and disadvantages of several types of additives for non-dye acidic electrodeposition of copper were summarized.A comparison was made with respect to the properties of the non-dye additives and dye additives.Moreover,the most widely accepted EPI series additives as representative non-dye additives were briefed,and some suggestions were given with respect to the development and prospect of the additives for copper electroplating. |
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| Keywords: | acidic copper electroplating additive non-dye review |
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