| Al2O3/Al-4.5Cu-Ce合金复合材料的界面现象 |
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| 引用本文： | 刘耀辉,李庆春.Al2O3/Al-4.5Cu-Ce合金复合材料的界面现象[J].复合材料学报,1992,9(2):89-94. |
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| 作者姓名： | 刘耀辉 李庆春 |
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| 作者单位： | 1. 吉林工业大学, 150006;2. 哈尔滨工业大学, 长春 130025 |
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| 摘 要： | 本研究采用座滴法和电子探针探讨了Al-4.5Cu-Ce合金的表面张力及其与Al2O3的界面润湿性、界面结构、界面结合方式和强度.得出:饰降低Al-4.5Cu合金的表面张力,提高Al2O3/Al-4.5Cu合金的润湿性和界面剪断应力;铈改善润湿性的机制是在界面上的吸附与富集,未发现铈与Al2O3的界面反应产物,界面仍属于直接结合界面.
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| 关 键 词： | Al2O3 Al-4.5 Cu-Ce合金 界面结合 润湿性 |
| 收稿时间： | 1991-07-05 |
INTERFACE PHENOMENON BETWEEN Al2O3 AND Al-4.5Cu-Ce ALLOY |
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| Liu Yaohui,He Zhenming,Yu Sirong,Chen Bingcong,Li Qingchun.INTERFACE PHENOMENON BETWEEN Al2O3 AND Al-4.5Cu-Ce ALLOY[J].Acta Materiae Compositae Sinica,1992,9(2):89-94. |
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| Authors: | Liu Yaohui He Zhenming Yu Sirong Chen Bingcong Li Qingchun |
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| Affiliation: | 1. Jilin University of Technology, Changchun;2. Harbin Institute of Technology, Harbin |
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| Abstract: | The surface tensions of A.1-4.5Cu-Ce alloy and the wettability,stru- eture,bond type and bond strength of the interface of Al2O3/Al-4.5Cu-Ce alloy were researched by means of modem testing equipment,e.g.,sessile drop method and electronic microprobe etc..The results show that by adding Ce,the surface tension of Al-4.5Cu alloy can be reduced,the wettability and interfacial cut-off stress of Al2O3/.Al-4.5Cu alloy can be improved.The mechanism of Ce improving wettability is due to Ce accumulation on the interface.No interfacial reaction product is found.The interface belongs to direct bond type. |
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| Keywords: | " target="_blank">2O3zz')" href="#"> Al2O3 Al-4 5Cu-Ce interface phenomenon |
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