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冲击环境下PBGA焊点动态特性分析
引用本文:陈逊,赵玫,孟光.冲击环境下PBGA焊点动态特性分析[J].振动与冲击,2004,23(4):131-134.
作者姓名:陈逊  赵玫  孟光
作者单位:上海交通大学,振动、冲击、噪声国家重点实验室,上海,200030
基金项目:航天技术创新基金资助项目
摘    要:根据焊点成形理论和影响焊点可靠性因素对PCB和PBGA256组件进行有限元建模,并以此为基础对其进行模态分析及瞬态冲击动态响应分析,得出了最大应力应变在PGBA256上分布曲线;并根据实际情况简化得出焊点局部模型应变分布,从而找出焊点最易断裂失效的区域。最后,通过激光测振系统测得的实验模态和计算结果比较,表明所建立的有限元模型,可作为以后进行焊点疲劳寿命估计和焊点形态优化的基础。

关 键 词:焊点  动态特性  有限元分析  激光测振  PBGA
修稿时间:2003年8月19日

Analysis on Dynamic Behavior of Pbga Solder Joints under Shock Loading
Chen Xun,Zhao Mei,Meng Guang.Analysis on Dynamic Behavior of Pbga Solder Joints under Shock Loading[J].Journal of Vibration and Shock,2004,23(4):131-134.
Authors:Chen Xun  Zhao Mei  Meng Guang
Abstract:A finite element model(FEM)of PCB and PBGA 256 assembly was set up by the shaping theory of SMT solder joints,in together consideration of factors affecting the reliability of SMT solder joints.The distribution of vonMises stress and vonMises strain in the model was obtained by modal analysis and teansient dynamic response analysis under shock loading.The weakest area in a SMT solder joint was found from a simplified local FEM.Finally,the experimental results from laser holographic interferometry were compared with computing data,which indicates that the FEM can be used in the shape optimization to increase the fatigue life of SMT solder joints.
Keywords:solder joint  dynamic behavior  finite element analysis  laser holographic interferometry
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