Fundamental study of adhesion of ice to cooling solid surface (Discussion on influence of copper oxide layer on ice adhesion force) |
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Authors: | Koji Matsumoto Michitaka Morohoshi Yoshikazu Teraoka |
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Affiliation: | aDepartment of Precision Mechanics, Chuo University, 1-13-27 Kasuga, Bunkyo-ku, Tokyo 112-8551, Japan |
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Abstract: | In many situations, ice often adheres to a cooling solid surface, frequently causing serious accidents. It is critical to clarify the mechanism of ice adhesion to the cooling surface in order to prevent ice adhesion. In a past study, the shearing stresses of two kinds of test plates with a copper surface having the higher thermal conductivity were measured. The shearing stress corresponds to ice adhesion force. Both shearing stresses were significantly different; however, the cause remains unclear.Therefore, the present study focuses on an oxide layer as the main factor causing the difference of both shearing stresses; the influence of the oxide layer formed on shearing stress was discussed. And in the removal and reformation processes of the oxide layer, the time variation of the shearing stress was clarified. Moreover, the relationship between the state of the copper surface and the shearing stress was also clarified by surface analysis. |
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Keywords: | Adhesion Ice Microchannel Surface Geometry Surface tension Experiment Coating Oxide CopperMots clé s: Adhé sion Glace Microcanal Surface Gé omé trie Tension superficielle Expé rimentation Revê tement Oxyde Cuivre |
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