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TC4合金TLP扩散焊的组织与性能
引用本文:程耀永,马文利,郭万林.TC4合金TLP扩散焊的组织与性能[J].材料工程,1999(12):31-34.
作者姓名:程耀永  马文利  郭万林
作者单位:北京航空材料研究院,北京,100095
摘    要:采用BTi35ZrCuNi非晶箔中间层合金对TC4钛合金进行了瞬间液相扩散焊(TLP),对接头的组织和性能、元素分布情况进行了测试分析。结果表明,在合适的规范下所得TLP接头组织为网蓝组织,强度达907MPa,断口分析表明,接头具有较好的韧性。

关 键 词:扩散焊  钛合金  非晶态箔
文章编号:1001-4381(1999)12-0000-00
修稿时间:1999-03-31

The Microstructure and Properties of TLP Diffusion Bonding Joints of TC4 Alloys
CHENG Yao-yong,MA Wen-li,Guo Wan-lin.The Microstructure and Properties of TLP Diffusion Bonding Joints of TC4 Alloys[J].Journal of Materials Engineering,1999(12):31-34.
Authors:CHENG Yao-yong  MA Wen-li  Guo Wan-lin
Abstract:Ti 6Al 4V alloy was bonded by TLP method using BTi35ZrCuNi amorphous foil as the interlayer alloy The microstructures and properties, as well as the element distribution of the joints were examined The results show that lamellar structure is formed in the bonding seam under suitable conditions, and the corresponding tensile strength of the joints reaches 907 MPa The joints also exhibit good toughness
Keywords:diffusion bonding  titanium alloy  morphous alloy
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