| Sn-9Zn-xP无铅焊料合金性能研究 |
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| 引用本文： | 黄惠珍,魏秀琴,帅歌旺,周浪. Sn-9Zn-xP无铅焊料合金性能研究[J]. 材料工程, 2010, 0(3) |
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| 作者姓名： | 黄惠珍 魏秀琴 帅歌旺 周浪 |
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| 作者单位： | 南昌大学,材料科学与工程学院,南昌,330031;南昌航空大学,材料科学与工程学院,南昌,330063 |
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| 基金项目： | 江西省教育厅科技项目 |
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| 摘 要： | 以Sn-9Zn合金为研究对象,考察了P的添加对其性能的影响,并对其机制作了初步探讨。通过二次离子质谱(SIMS)分析发现,P的添加显著降低Sn-9Zn合金中的含氧量,从而提高了合金在Cu上的润湿性。P的改善润湿性的效果不仅有利于其工艺性能,也提高了Sn-9Zn/Cu焊点界面的结合强度,只使其塑性略有下降。同时,微量P的添加不改变Sn-9Zn合金与Cu形成的焊点的界面结构。另外,蠕变强度测试结果表明,P的添加能显著提高合金的抗蠕变性能。
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| 关 键 词： | Sn-Zn合金 无铅焊料 P 润湿性 蠕变 |
Study on the Properties of Sn-9Zn-xP Lead-free Solder Alloy |
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| HUANG Hui-zhen,WEI Xiu-qin,SHUAI Ge-wang,ZHOU Lang. Study on the Properties of Sn-9Zn-xP Lead-free Solder Alloy[J]. Journal of Materials Engineering, 2010, 0(3) |
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| Authors: | HUANG Hui-zhen WEI Xiu-qin SHUAI Ge-wang ZHOU Lang |
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| Abstract: | Effects of P addition on the properties of Sn-9Zn eutectic lead-free solder alloy have been studied. The results show that P could significantly improve the wettability of Sn-9Zn to Cu because P addition can decrease the content of oxygen in Sn-Zn alloy by the application of Secondary Ion Mass Spectrometry (SIMS) analysis. P addition enhances the creep strength of the Sn-9Zn bulk materials and the shear strength of Sn-9Zn/Cu joints, while decreases its ductility. No significant change in the interfacial structure of Sn-9Zn/Cu joints was observed by addition of P. The mechanisms were also discussed. |
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| Keywords: | P Sn-Zn alloy lead-free solder phosphorus,wettability creep |
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