| 碱性氰化物防渗碳光亮镀铜工艺的研究 |
| |
| 引用本文： | 李家柱,马颐军.碱性氰化物防渗碳光亮镀铜工艺的研究[J].材料工程,1994(5):26-28,4. |
| |
| 作者姓名： | 李家柱 马颐军 |
| |
| 作者单位： | 北京航空材料研究所 |
| |
| 摘 要： | 本文介绍了一种高效率，高韧性，防渗碳底铜工艺，可以大辐度提高镀层的沉积速度，降低铜层孔隙率，提高产品合格率，具有显著的经济效益和社会效益。
|
| 关 键 词： | 防渗碳 镀铜 碱性氧化物 |
Investigation on Anticarbonized Bright Copper-plating Process in Basic Cyanide Baths |
| |
| Li Jiazhu,Ma Yijing.Investigation on Anticarbonized Bright Copper-plating Process in Basic Cyanide Baths[J].Journal of Materials Engineering,1994(5):26-28,4. |
| |
| Authors: | Li Jiazhu Ma Yijing |
| |
| Affiliation: | Beijing Institute of Aeronautical Materials |
| |
| Abstract: | his paper instroduces an anticarbonized copper-plating process with highcurrent efficience and high ductility.This process can increase copper-plated depositing rate,decrease the hole ratio of copper de-posit,increase the qualified ratio of products,so it has remarkable economic benefit and social benefit. |
| |
| Keywords: | high current efficiency anticarbonized copper-plating |
| 本文献已被 CNKI 维普 等数据库收录！ |
