磁控溅射Cu-Nb和Cu-Mo薄膜结构与性能

采用磁控溅射制备含1.16%～15.8%(原子分数)Nb的Cu-Nb及含2.2%～27.8%Mo的Cu-Mo合金薄膜,井采用EDX、XRD、SEM、显微硬度仪和电阻计对薄膜的成分、结构和性能进行研究。结果表明,Nb和Mo的添加分别使Cu-Nb及Cu-Mo薄膜晶粒显著细化,Cu-Nb和Cu-Mo薄膜呈纳米晶结构,存在Nb在Cu中的fcc Cu(Nb)和Mo在Cu中的fcc Cu(Mo)非平衡亚稳过饱和固溶体,固溶度随Nb或Mo含量增加而上升。添加Nb和Mo显著提高Cu-Nb及Cu-Mo薄膜的显微硬度和电阻率,且随Nb或Mo含量增加而升高。经650℃热处理1h后,Cu-Nb和Cu-Mo薄膜显微硬度和电阻率均下降,且分析表明均发生基体相晶粒长大,并出现微米-亚微米级富Cu第二相,Cu-Nb及Cu-Mo薄膜结构和性能形成及演变的主要原因是添加的Nb、Mo引起的晶粒细化效应以及退火中基体相晶粒度的增大。

Structures and Properties of Cu-Nb and Cu-Mo Thin Films Deposited by Magnetron Sputtering

Cu-Nb alloy thin films with 1.16%～15.8%Nb and Cu-Mo alloy thin films with 2.2%～27.8%Mo were prepared by magnetron sputtering.The compositions,structures and properties of thin films were investigated by EDX,XRD,SEM,microhardness instrument and resistivity meter.The results showed that the grain size of Cu-Nb and Cu-Mo alloy thin films were refined by Nb and Mo addition,respectively.Cu-Nb and Cu-Mo thin films possessed nanocrystalline structure with the presence of fcc Cu(Nb) and fcc Cu(Mo) non-equilibrium metastable supersa-turated solid solution,the solubility increased with the incremental Nb and Mo concentration.The microhardness and electrical resistivity of Cu-Nb and Cu-Mo thin films significantly increased by adding Nb and Mo,and both of them were improved with the increase of Nb and Mo content.The microhardness and resistivity of Cu-Nb and Cu-Mo decreased after heat-treament at 650℃ for 1h.Analysis revealed a coarseness in the grain sizes of the matrix phases of Cu-Nb and Cu-Mo films and the appearance of micron-submicron Cu-rich second-phase.The formation and evolution of the microstructure and the properties of Cu-Nb and Cu-Mo thin films could be mainly attributed to the grain refining effect caused by Nb and Mo addition as well as the growth of matrix phases grain sizes in annealing process.