新型喷射成形轻质、高导热、低膨胀Si-Al电子封装材料

传统封装材料的性能已经不能满足微电子技术飞速发展的需要，为此，国内外相继采用喷射成形技术研究开发了适用于电子行业发展的新型Si-Al系列合金，这种高硅（50－70wt%)合金具有细小均匀的显微组织，以及均匀和各向同性的性能，同时具有低热膨胀系数，高热导率和低密度等特点，与普通碳化硅增强金属基复合材料（MMCs)不同，新合金可以用普通刀具进行加工，并且容易进行镀镍，铜、银和金等涂覆处理，采用上述材料已成功地制备了航空应用的微波放大器模块，比全可伐合金封装减重约30％以上，对喷射成形Si-Al合金的研究开发现状进行了简单评述。

New Spray Formed Light Weighted Si-Al Electronic Packaging Materials with Low Thermal Expansion and High Heat Conducting

The properties of traditional packaging can no longer satisfy the needs of rapid development of microelectronic technology.Therefore a new series of Si-Al alloys suitable for application in electronics industries have been developed with spray forming technique both in developed countries and in China.The spray formed alloys with high S1 contents (50-~70wt%) show fine and homogeneous microstructures.excellent comprehensive properties,and especially they have,at the same time,lower thermal expansion coefficients,higher heat conductivity and lower density compared with the traditional packaging materials.Unlike the common SiC reinforced metal matrix composites (MMCs),the new alloys can be machined with the traditional cutting tools,and can be easily coated by Ni,Cu,Ag or Au.The new materials have been successfully applied in aeronautical industry such as microwave magnifier with a 30% weight reduction compared with the packaging made of Kovar alloy.A brief review of the research and development of the spray formed Si-Al alloys is given below.