| FeNi42引线框架材料的研究进展 |
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| 引用本文： | 付锐,冯涤,陈希春,朱筱北.FeNi42引线框架材料的研究进展[J].材料导报,2007,21(11):85-87. |
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| 作者姓名： | 付锐 冯涤 陈希春 朱筱北 |
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| 作者单位： | 1. 钢铁研究总院高温材料研究所,北京,100081
2. 宁夏东方钽业股份有限公司,石嘴山,753000 |
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| 基金项目： | 国家高技术研究发展计划(863计划) |
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| 摘 要： | FeNi42合金常被用于制作高可靠性陶瓷封装集成电路的引线框架.随着集成电路向高集成度、多功能化和小型化方向发展,其引线数增多、引线间距减小,因此对引线框架材料的强度和冲裁加工性能提出了更高的要求.主要概述了在提高引线框架用FeNi42合金薄带强度和冲裁加工性能方面的研究进展,指出合金中非金属夹杂物的数量、尺寸和分布对带材性能有重要的影响,同时分析了国产该材料存在的主要问题.
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| 关 键 词： | 引线框架材料 FeNi42合金 集成电路 |
The Research Development of FeNi42 Leadframe Material |
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| FU Rui,FENG Di,CHEN Xichun,ZHU Xiaobei.The Research Development of FeNi42 Leadframe Material[J].Materials Review,2007,21(11):85-87. |
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| Authors: | FU Rui FENG Di CHEN Xichun ZHU Xiaobei |
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| Abstract: | FeNi42 alloy is usually used to make lead frame of high-reliable IC packaged by ceramic. With the development of IC to high density, multifunction and miniaturization, the amount of lead increase,and lead pitch space decreases, which demand high strength and excellent punchability Eor leadframe materials. In this paper, the current status of research on how to improve the strength and punchability of FeNi42 leadframe material is summarized, and the effects of nonmetallic inclusions on the strip properties are pointed out. At the same time, the main problems of domestic FeNi42 leadframe materials are analyzed. |
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| Keywords: | leadframe materials FeNi42 alloy IC |
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