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| 铜合金引线框架材料的发展* | |
| 引用本文： | 赵冬梅,董企铭,刘平,金志浩,黄金亮.铜合金引线框架材料的发展*[J].材料导报,2001,15(5):18-20. |
| 作者姓名： | 赵冬梅 董企铭 刘平 金志浩 黄金亮 |
| 作者单位： | 1. 西安交通大学材料学;洛阳工学院材料系, 2. 洛阳工学院材料系, 3. 西安交通大学材料学院, |
| 基金项目： | 国家自然科学基金50071026 |
| 摘 要： | 介绍了国内外铜合金框架材料研究，生产现状，叙述了开发高强，高导铜合金的基本原理及制备方法，半对国内外高强，高导铜合金的研究和开发应用情况进行了综合，同时评述了铜合金引线框架材料的发展动向。 |
| 关 键 词： | 铜合金引线框架材料 强化 导电率 高强度高导电铜合金 制备 |
Development of Copper Alloy for Leadframe |
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| Zhao Dongmei,Dong Qiming,Liu Ping,Jin Zhihao,Huang Jinliang School of Materials Science and Engineering,Xi'an Jiaotong University,Xi'an.Development of Copper Alloy for Leadframe[J].Materials Review,2001,15(5):18-20. | |
| Authors: | Zhao Dongmei Dong Qiming Liu Ping Jin Zhihao Huang Jinliang School of Materials Science and Engineering Xi'an Jiaotong University Xi'an |
| Affiliation: | Zhao Dongmei,Dong Qiming,Liu Ping,Jin Zhihao,Huang Jinliang 1 School of Materials Science and Engineering,Xi'an Jiaotong University,Xi'an 710049 2 Department of Materials Engineering,Luoyang Institute of Technology,Luoyang 471039 |
| Abstract: | The present situation of copper alloy materials for leadframe is introduced in this paper and the basic principle and the methods adopted to obtain high conductivity and high strength copper based alloys are also de- scribed. The present status and future prospects for study and application of these alloys are summarized. |
| Keywords: | copper based alloy strengthening electronic conductivity |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |