| Sn3.0Ag0.5Cu3.0Bi钎料对化学镀镍SiCp/6063Al复合材料真空钎焊接头组织和性能的影响 |
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| 引用本文： | 范晓杰,徐冬霞,王鹏,牛济泰,王东斌,陈思杰.Sn3.0Ag0.5Cu3.0Bi钎料对化学镀镍SiCp/6063Al复合材料真空钎焊接头组织和性能的影响[J].材料导报,2016,30(4):98-101. |
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| 作者姓名： | 范晓杰 徐冬霞 王鹏 牛济泰 王东斌 陈思杰 |
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| 作者单位： | 1. 河南理工大学材料学院,焦作,454003;2. 河南理工大学材料学院，焦作 454003; 哈尔滨工业大学先进焊接与连接国家重点实验室，哈尔滨 150001; 河南晶泰航空航天高新科技有限公司，焦作 454003 |
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| 基金项目： | 河南省教育厅科学技术研究重点项目(13A430326)；河南省科技攻关项目(142102210434)；河南省高等学校矿业工程材料重点学科开放实验室开放课题(MEM14-18)；河南理工大学青年基金(Q2012-25A)；河南理工大学博士基金(B2009-74) |
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| 摘 要： | 采用Sn3.0Ag0.5Cu3.0Bi软钎料对镀镍后的两种不同体积比SiC_p/6063Al复合材料进行真空钎焊。通过SEM、剪切试验等方法分析了化学镀镍后SiC_p/6063Al复合材料真空钎焊接头的显微组织以及保温时间对接头性能的影响。结果表明:两种不同体积比SiC_p/6063Al复合材料真空钎焊后的焊缝组织致密,钎料对镀镍复合材料的润湿性良好;在270℃、保温35min的钎焊工艺下,钎焊接头的剪切强度最大值为38.3 MPa;钎料中的Sn、Cu元素能够与复合材料表面的Ni层发生化学反应,实现钎料与母材的冶金结合;镀镍后SiC_p/6063Al复合材料真空钎焊接头断裂形式为韧性断裂为主的混合断裂,断裂主要发生在钎料内部,部分发生在镀镍层与钎料的结合处。
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| 关 键 词： | SiCp/6063Al复合材料 真空软钎焊 显微组织 剪切强度 |
Effect of Sn3.0Ag0.5Cu3.0Bi on Microstructure and Performance of Soldered Joints of SiCp/6063Al Composite After Electroless Nickel Plating in Vacuum Soldering |
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| FAN Xiaojie,XU Dongxi,WANG Peng,NIU Jitai,WANG Dongbin and CHEN Sijie.Effect of Sn3.0Ag0.5Cu3.0Bi on Microstructure and Performance of Soldered Joints of SiCp/6063Al Composite After Electroless Nickel Plating in Vacuum Soldering[J].Materials Review,2016,30(4):98-101. |
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| Authors: | FAN Xiaojie XU Dongxi WANG Peng NIU Jitai WANG Dongbin and CHEN Sijie |
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| Affiliation: | FAN Xiaojie;XU Dongxia;WANG Peng;NIU Jitai;WANG Dongbin;CHEN Sijie;Department of Materials Science and Engineering,Henan Polytechnic University;State Key Laboratory of Advanced Welding Production Technology,Harbin Institute of Technology;Henan Jingtai Aerospace High-Novel Materials Technology Co.,Ltd.; |
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| Abstract: | SiCp/6063Al composite containing high and low volume fraction SiC after electroless nickel plating were soldered by using Sn3.0Ag0.5Cu3.0Bi solder in vacuum.The vacuum soldered joint microstructure between SiCp/6063Al composite after electroless nickel plating and the effect of holding time on the property of joint were stu-died by means of SEM and shearing test.The results showed that the microstructure of soldering seam was quite com-pact since the lead-free solder could wet SiCp/6063Al composite after electroless nickel plating very well.The shear strength of the soldered joint reached to maximum of 38.3 MPa under soldering temperature of 270 ℃ and holding time for 35 min.The element Sn and Cu from the solder reacted with Ni on the SiCp/6063Al composite,resulting in a metallurgical bonding between the solder and base material.The fracture mode of soldered joint of the SiCp/6063Al composite after electroless nickel plating was mixed ductile mainly of ductile fracture.Fracture occurred in the solder mostly and occurred around the IMC layer rarely. |
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| Keywords: | SiCp/6063Al composites vacuum soldering microstructure shear strength |
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