| 集成电路用金属铜基引线框架和电子封装材料研究进展 |
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| 引用本文： | 陈文革,王纯.集成电路用金属铜基引线框架和电子封装材料研究进展[J].材料导报,2002,16(7):29-30,57. |
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| 作者姓名： | 陈文革 王纯 |
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| 作者单位： | 西安理工大学材料科学与工程学院,西安,710048 |
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| 摘 要： | 针对集成电路向高密度、小型化、多功能化发展，介绍了国内外传统的和以铜为基复合新型的引线框架和电子封装材料的性能、研究、生产现状以及存在的问题，同时展望了铜合金及其复合的引线框架和电子封装材料的发展趋势。
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| 关 键 词： | 集成电路 电子封装材料 研究进展 引线框架 铜基合金 复合材料 |
Advances in Copper-matrix Material for Leadframe and Electronic Packaging of Integrated Circuitry(IC) |
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| CHEN Wenge WANG Chun.Advances in Copper-matrix Material for Leadframe and Electronic Packaging of Integrated Circuitry(IC)[J].Materials Review,2002,16(7):29-30,57. |
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| Authors: | CHEN Wenge WANG Chun |
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| Abstract: | In light of the fact that integrated circuits (IC) are growing denser.smaller and more multi-func
tional,the characteristics,present status,application prospect and existing problems of traditional and new copper-matrix for leadframe and electronic packaging materials is described.And the developing trends of the copper-matrix leadframe and electronic packaging materials are forecasted in this paper. |
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| Keywords: | leadframe electronic packaging copper based alloy composite material |
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