固态扩散连接空洞闭合模型的研究进展

扩散连接是一种在固态下将2个同种或异种的材料连接在一起的先进连接方法.这种方法既可以连接低碳钢,也可以连接陶瓷,甚至还可以连接传统焊接方法所不能连接的材料.在很多材料没有实验数据的条件下,预测扩散连接所需时间是非常重要也是非常困难的,因此利用空洞闭合模型对扩散连接过程进行研究是当前固态扩散连接研究的重要方面.介绍了扩散连接空洞闭合的几个典型模型,对几何模型的选择进行了阐述,并对扩散连接的机制进行了解释和说明,同时比较了这几个模型的优缺点,并预测了扩散连接空洞闭合模型的发展方向.

Research Progress in Model of Void Closure in Solid-state Diffusion Bonding

Diffusion bonding is an advanced bonding process in which two materials,similar or dissimilar,can be bonded in solid state.This provides to bond materials in a wide range from low carbon steels to ceramics and com-posites which cannot be bonded with conventional welding methods.The estimation of final bonding time is very im-portant but difficult without experiments for many materials.It is important for the study of diffusion bonding to es-tablish a model of void shrinkage.The typical models of void shrinkage in diffusion bonding are reviewed.A variety of geometric models are overviewed in this paper.The mechanisms of diffusion bonding are explained at the same time.The advantages and disadvantages of these models and the differences among these models are also discussed.