化学机械抛光技术及SiO2抛光浆料研究进展

随着半导体工业和集成电路(IC)工艺的飞速发展，化学机械抛光(CMP)作为目前唯一能提供超大规模集成电路(VLSI)制造过程中全面平坦化的一种新技术，已成为各国争相研究的热点。介绍了CMP技术的产生、优势、发展、理论、设备与耗材；着重介绍了SiO2浆料的国内外研究现状，并展望了CMP技术及SiO2浆料的研究开发和应用前景。

Chemical Mechanical Polishing Technique and the Development of Silica CMP Slurry

With development of semiconductor industry and integrated circuit technics, chemical mechanical polishing (CMP) has emerged as the most effective technique for achieving global planarization of VLSI being researched by many countries. In this thesis, the author introduces briefly the history of CMP,the advantages, development, theories, technical equipments and expendables of CMP. Focusing on present status of the silica slurry in the world and forecasting the prospect of CMP and the silica slurry.