| SiCp/Al电子封装复合材料的现状和发展 |
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| 引用本文： | 向华,曲选辉,肖平安,李乐思.SiCp/Al电子封装复合材料的现状和发展[J].材料导报,2003,17(2):54-57. |
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| 作者姓名： | 向华 曲选辉 肖平安 李乐思 |
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| 作者单位： | 1. 中南大学粉末冶金国家重点实验室,长沙,410083
2. 中南大学粉末冶金国家重点实验室,长沙,410083;北京科技大学材料科学与工程学院,北京100083 |
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| 摘 要： | 随着微电子技术的高速发展，SiCp/Al作为新型的电子封装材料受到了广泛的重视。根据近年来报导的有关资料，对SiCp/Al电子封装复合材料的性能、制备工艺及应用发展进行了综述，并指出了未来的研究方向。
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| 关 键 词： | SiCp／Al 电子封装 复合材料 封装材料 制备工艺 碳化硅 铝 |
Current Status and Development Prospect for SiCp/Al Metal-Matrix Composites for Electronic Packaging |
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| XIANG Hua QU Xuanhui XIAO Pingan LI Leshi
State Key Laboratory of Powder Metallurgy,Central South University,Changsha, School of Materials Science and Engineering,University of Science and Technology,Beijing.Current Status and Development Prospect for SiCp/Al Metal-Matrix Composites for Electronic Packaging[J].Materials Review,2003,17(2):54-57. |
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| Authors: | XIANG Hua QU Xuanhui XIAO Pingan LI Leshi
State Key Laboratory of Powder Metallurgy Central South University Changsha School of Materials Science and Engineering University of Science and Technology Beijing |
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| Affiliation: | XIANG Hua QU Xuanhui XIAO Pingan LI Leshi
State Key Laboratory of Powder Metallurgy,Central South University,Changsha,410083, School of Materials Science and Engineering,University of Science and Technology,Beijing,100083 |
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| Abstract: | With the rapid development of microelectronic technology,SiCp/Al metal-matrix composites as a new electronic packaging material have received more and more attention.This paper overviews SiCp/Al properties,manufacturing process and applications based on relevant information recently published.and points out the problems to be resolved in the future. |
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| Keywords: | SiCp/Al package composites manufacturing process |
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