| 高强高导铜合金设计思路及其应用 |
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| 引用本文： | 张生龙,尹志民.高强高导铜合金设计思路及其应用[J].材料导报,2003,17(11):26-29. |
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| 作者姓名： | 张生龙 尹志民 |
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| 作者单位： | 1. 宝钢集团上海钢铁研究所,上海,200940
2. 中南大学材料科学与工程学院,长沙,410083 |
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| 摘 要： | 综述了高强高导铜合金的设计思路，分析了不同高强高导铜合金的强化机制和导电机制，并指出了高强高导铜合金的发展动向。
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| 关 键 词： | 铜合金 强化机制 导电机制 物理性能 功能材料 力学性能 |
High-strength and High-conductivity Copper Alloys: Designing Considerations and Their Application |
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| ZHANG Shenglong YIN Zhimin.High-strength and High-conductivity Copper Alloys: Designing Considerations and Their Application[J].Materials Review,2003,17(11):26-29. |
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| Authors: | ZHANG Shenglong YIN Zhimin |
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| Abstract: | This paper reviews various considerations in designing high-strength and high-conductivity copper alloys,analyzes the strengthening and electric conduction mechanisms of different alloys,and points out future directions of high-strength and high-conductivity copper alloys. |
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| Keywords: | copper alloys strengthening mechanism electric conductivity mechanism designing consideration |
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