压药压力对硅系延期药燃速影响的试验研究

通过测量不同压力压装的单芯延期体的压药密度、燃烧速度,研究了压药压力对硅系延期药燃速及其精度的影响。测试结果表明:压药压力在40~640 MPa范围内,对应压药密度为3.15~4.08 g/cm~3、延期药燃速为187.74~258.26 mm/s;压药压力与平均压药密度、平均燃速均呈良好的线性关系;随着压药压力的增加,延期精度变好;640 MPa压药压力下硅系延期药燃速标准差最小,延期精度最高。

Experimental Study on Effect of Loading Pressure on the Burning Rate of Silicon Type Delay Composition

Effect of loading pressure on burning rate and delay precision of silicon type delay composition was studied by measuring the charging density and the burning rate of the single core delay elements with different loading pressure.Results show that,in the range of 40 ～ 640 MPa the charging density changes from 3.15 g/cm3 to 4.08 g/cm3,and the burning rate changes from 187.74 mm/s to 258.26 mm/s.The correlation of the loading pressure and the charging density,or the loading pressure and the burning rate,shows a good linear relationship.With the increase of loading pressure,delay precision increases.The minimum standard deviation of burning rate and the highest delay precision appear at 640 MPa.