反应磁控溅射法制备(Ti,Al)N薄膜的力学性能

以WF6和H2为原料,采用化学气相沉积法在纯铜基体上沉积出难熔金属钨涂层。分析研究了不同沉积温度(500℃,600℃,700℃)沉积层显微组织、表面形貌、表面粗糙度及相关机制。试验分析表明:随沉积温度升高,沉积速率加快,涂层组织柱状晶生长取向趋于杂乱;沉积层表面形貌发生明显改变,表面粗糙度显著增加。杂质颗粒对沉积组织有显著的影响,造成沉积表面粗糙度显著增加。

Mechanical Properties of (Ti,Al)N Films Deposited by Reactive Magnetron Sputtering

Tungsten coating is prepared successfully on pure copper substrate by chemical vapor deposition using the mixture of WF_6 and H_2. The microstructure, surface appearance, surface roughness and correlation mechanism of different deposition temperatures with 500 ℃, 600 ℃, 700 ℃ respectively have been analyzed, and the results show that with the increase of deposition temperature, the deposition speed accelerates, the columnar grain microstructure growth tends to disorder, surface appearance undergoes significant changes, and surface roughness also increases on a marked basis. Impurity particles have a significant impact on deposition microstructure, resulting in the marked increase in surface roughness.