采用两种银基活性钎料钎焊AlN陶瓷与可伐合金的接头组织与性能

采用Ag-Cu-Ti和Ag-Cu-In-Ti两种活性钎料箔带，分别在860℃/10 min和760℃/10 min两种规范下对AlN与可伐合金(4J29)进行了真空钎焊连接，获得了冶金质量良好的接头. 对接头室温抗剪强度进行了测试，AlN/Ag-Cu-Ti/4J29和AlN/Ag-Cu-In-Ti/4J29两种接头强度分别为126和113 MPa. 微观分析结果表明，两种接头中靠近陶瓷母材附近生成了连续的扩散反应层，结合XRD结果，该层主要由TiN相组成，反应层的厚度对接头强度有影响；钎缝基体区由铜基固溶体、银基固溶体和复杂的Ni(Fe，Co)-Ti化合物组成.

Microstructure and strength of AlN/Kovar alloy joints brazed with two Ag-based active filler metals

Ag-Cu-Ti and Ag-Cu-In-Ti active filler metals were used to braze AlN ceramic and Kovar alloy in the vacuum brazing furnace. The corresponding brazing parameters were 860 °C/10 min and 760 °C/10 min, respectively, and sound AlN/ Kovar alloy joints were obtained. The shear strengths of AlN/Ag-Cu-Ti/4J29 and AlN/Ag-Cu-In-Ti/4J29 joints were 126 and 113 MPa, respectively. The microanalysis results show that a continuous diffusion layer formed near the ceramic substrate. The TiN phase was detected in the layer by XRD. The thickness of the diffusion layer had obvious effect on the joint strength. Cu(s,s), Ag(s,s) and Ni(Fe, Co)-Ti compounds formed in the brazing seam matrix.