| Bi对Sn-0.3Ag-0.7Cu无铅钎料熔点及润湿性能的影响 |
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| 引用本文： | 孙凤莲,胡文刚,王丽凤,马鑫.Bi对Sn-0.3Ag-0.7Cu无铅钎料熔点及润湿性能的影响[J].焊接学报,2008,29(10):5-8. |
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| 作者姓名： | 孙凤莲 胡文刚 王丽凤 马鑫 |
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| 作者单位： | 1. 哈尔滨理工大学,材料科学与工程学院,哈尔滨,150040
2. 亿铖达工业有限公司,广东,深圳,518101 |
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| 基金项目： | 国家自然科学基金，哈尔滨科技创新人才研究专项基金 |
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| 摘 要： | 研究了添加适量的Bi元素对低银型Sn-0．3Ag-0．7Cu无铅钎料合金性能的影响，应用差示扫描量热仪和SAT-5100型润湿平衡仪对Sn-0．3Ag-0．7Cu·xBi（x=0.1，3，4．5）钎料的熔点、润湿性能作了对比试验分析。结果表明，一定量Bi元素的加入可以降低Sn-0．3Ag-0．7Cu钎料合金的熔点，并改善其润湿性能。但过多的Bi元素会导致钎料的液固相线温度差增大，塑性下降，造成焊点剥离缺陷。综合考虑得到Sn-0．3Ag-0．7Cu-3．0Bi无铅钎料具有最佳的综合性能。
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| 关 键 词： | 无铅钎料 熔点 润湿性 焊点剥离 |
| 收稿时间： | 2007/12/3 0:00:00 |
Influence of Bi on the melting point and wettability of Sn-0.3Ag-0.7Cu lead-free solder |
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| SUN Fenglian,HU Wengang,WANG Lifeng and MA Xin.Influence of Bi on the melting point and wettability of Sn-0.3Ag-0.7Cu lead-free solder[J].Transactions of The China Welding Institution,2008,29(10):5-8. |
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| Authors: | SUN Fenglian HU Wengang WANG Lifeng and MA Xin |
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| Affiliation: | School of Materials Science & Engineering, Harbin university of Science and Technology, Harbin 150040, China,School of Materials Science & Engineering, Harbin university of Science and Technology, Harbin 150040, China,School of Materials Science & Engineering, Harbin university of Science and Technology, Harbin 150040, China and Yik shing Tat Industrial Corporation limited Company, Shenzhen 518101, Guangdong, China |
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| Abstract: | The influences of Bi on the melting point and wettability of Sn-0.3Ag-0.7Cu lead-free solder alloy were studied.The contrastive experiments and analysis on the melting point, wettability of Sn-0.3Ag-0.7Cu-xBi (x=0, 1, 3, 4.5)solders were carried out by differential scanning calorimetry and wetting balance equipment. Results show that the addition of Bi can decrease the melting point and improve the wettability of Sn-0.3Ag-0.7Cu lead-free solder alloy.But the amount of Bi should be limited.Because the excess element of Bi could increase the melting range of solder, decrease the plasticity of solder and result in the flaw of fillet lifting.Sn-0.3Ag-0.7Cu-3.0Bi lead-free solder performed an excellent cornprehensive properties. |
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| Keywords: | lead-free solder melting point wettability fillet lifting |
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