低温烧结纳米银膏研究进展

金属纳米颗粒因尺寸效应可在较低温度下实现烧结，并表现出优异的电热学性能、机械可靠性和耐高温性能，成为适配第三代半导体的关键封装材料. 其中，银因具有高抗氧化性的优势被广泛研究，并成功应用于商业应用中. 基于功率器件封装领域，总结了低温烧结纳米银膏的研究现状，并从纳米银颗粒的烧结机制、制备方法、性能优化、烧结方法、可靠性及商业应用等方面展开说明. 结果表明，随着对烧结理论的进一步认识，可以有目的性地优化纳米银颗粒的尺寸和表面修饰，同时基于纳米银颗粒衍生出新型的产品，以适应不同的烧结工艺和性能要求.

Research progress of low-temperature sintering nano silver paste

Because of the size effect, metal nanoparticles have become the key packaging materials suitable for the third-generation semiconductor due to their low-temperature sintering, excellent electrothermal properties, mechanical reliability and high-temperature resistance. Silver has been widely studied and successfully applied in commercial applications because of its high oxidation resistance. Based on the field of power device packaging, the research progress of the low-temperature sintering nano silver paste was summarized, including the sintering mechanism, preparation method, performance optimization, sintering methods, reliability and commercial application of silver nanoparticles. The results showed that with the better understanding of sintering theory, the size and surface modification of silver nanoparticles can be purposefully optimized, and new products based on silver nanoparticles can be derived to adapt to different sintering processes and performance requirements.