铜颗粒低温烧结技术的研究进展

金属纳米材料因具有良好的导电导热性以及能够在较低温度下进行烧结，是功率器件在高温高压高频等工作环境下服役所需的关键电子封装材料之一.文中对应用于功率器件封装领域的铜颗粒实现烧结的研究进行了综述，阐明了目前通过铜颗粒烧结技术实现低温键合的研发背景.从铜颗粒烧结材料的制备、工艺参数和还原方法等关键影响因素出发，讨论、归纳了基于不同烧结机理的低温烧结铜颗粒材料接头的力学性能和电学性能.此外，介绍了铜颗粒烧结技术在贴片封装和全铜互连领域中应用的优良特性.通过对该领域研究成果的分析，结果表明，目前铜烧结材料仍然受到氧化问题的挑战，需要进一步在接头性能的精准调控方面深入研究.

Research progress of low temperature sintering technology for Cu particles

Metallic nanomaterials are one of the key electronic packaging materials required for power devices in service under high temperature, high pressure and high frequency operating conditions due to their good electrical, thermal conductivity and the ability to be sintered at low temperatures. In this paper, the research on sintering of Cu particles used in power device packaging is reviewed. The current research and development background of low-temperature bonding through Cu particle sintering technology is expounded. The mechanical and electrical properties of low-temperature sintered Cu particle material joints based on different sintering mechanisms are discussed and summarized from the key influencing factors such as preparation of Cu particle paste, technological parameters of sintering process and reduction methods. The excellent characteristics of Cu particle sintering technology applied in the field of die attach and all-Cu interconnects are introduced. The comprehensive analyses of researches show that the current Cu particle materials are still challenged by the oxidation problem, and further in-depth research is needed to achieve precise regulation of the joint properties.