热处理对Cu/Al-3.25Si合金冷压焊接复合带界面组织与性能的影响

利用金相显微镜、扫描电镜、万能材料实验机等,研究了Cu/Al-3.25Si合金冷压焊接复合带热处理工艺,讨论了界面层厚度、界面结合强度、铜铝金属间化合物生成规律等问题. 结果表明,随着热处理温度的升高和保温时间的增加,扩散层厚度的增长呈现先快再慢的趋势,动力学曲线时间指数在0.5~1之间;界面的结合强度随着热处理温度和保温时间的增加呈先升高后降低的趋势;界面金属间化合物有Cu₉Al₄,CuAl,CuAl₂等;最佳热处理温度宜控制在200~300 ℃,保温时间在2 h以内.

Effect of heat treatment on interface microstructure and property of Cu/Al-3.25Si cold-press welded joint

The influence of heat treatment process on the interface thickness,interfacial bonding strength and the compounds change of Cu/Al-3.25Si cold-press joining was investigated by measuring the mechanical properties and observing microstructure. The results showed that the inter-layer thickness was firstly growing quickly with the increase of heat treatment temperature and holding time, and then it was growing slowly. The kinetics of the diffusion layer growth hasa index of 0.5-1. The interfacial shear strength is also growing quickly with the increase of heat treatment temperature and preservation time and then slowly. The intermetallic compounds is Cu₉Al₄, CuAl, CuAl₂ from the copper side to the aluminum side under the optimum condition of 300 ℃×2 h.