| 低银SnAgCuBi-xNi/Cu焊点塑性及蠕变性能 |
| |
| 引用本文： | 杨淼森,孙凤莲,邹鹏飞.低银SnAgCuBi-xNi/Cu焊点塑性及蠕变性能[J].焊接学报,2014,35(3):31-34. |
| |
| 作者姓名： | 杨淼森 孙凤莲 邹鹏飞 |
| |
| 作者单位： | 哈尔滨理工大学材料科学与工程学院; |
| |
| 基金项目： | 国家自然科学基金资助项目(51174069) |
| |
| 摘 要： | 借助纳米压痕方法,基于压痕做功和压痕蠕变的原理,对SnAgCuBi-xNi/Cu(x=0,0.05,0.1,0.15,0.2)低银焊点的塑性和抗蠕变性能进行了研究.结果表明,在SnAgCuBi-xNi/Cu焊点中,Ni元素含量为0.05%和1%,焊点的硬度和塑性提高,抗蠕变性能变化不明显,Ni元素含量为0.15%和0.2%,焊点的硬度和抗蠕变性能提高,但焊点塑性下降.Ni元素的添加有利于提高SnAgCuBi/Cu焊点的高温稳定性.在150℃下经400 h老化,焊点的抗蠕变性能随着Ni元素含量的增加而增强,含镍焊点的硬度均高于SnAgCuBi/Cu焊点,Ni元素含量为0.1%的焊点塑性最好.
|
| 关 键 词： | 纳米压痕 塑性 蠕变 硬度 |
| 收稿时间： | 2013/5/8 0:00:00 |
Plasticity and creep performance of low-Ag SnAgCuBi-xNi/Cu solder joint |
| |
| YANG Miaosen,SUN Fenglian and ZOU Pengfei.Plasticity and creep performance of low-Ag SnAgCuBi-xNi/Cu solder joint[J].Transactions of The China Welding Institution,2014,35(3):31-34. |
| |
| Authors: | YANG Miaosen SUN Fenglian and ZOU Pengfei |
| |
| Affiliation: | School of Materials Science Engineering, Harbin University of Science and Technology, Harbin 150040, China,School of Materials Science Engineering, Harbin University of Science and Technology, Harbin 150040, China and School of Materials Science Engineering, Harbin University of Science and Technology, Harbin 150040, China |
| |
| Abstract: | |
| |
| Keywords: | nanoindentation plasticity creep hardness |
| 本文献已被 CNKI 等数据库收录！ |
| 点击此处可从《焊接学报》浏览原始摘要信息 |
|
点击此处可从《焊接学报》下载全文 |
|
