钎焊时间对镀镍SiCP/Al复合材料界面IMC生长的影响

采用Sn-3.0Ag-0.5Cu-3.0Bi钎料对镀镍60%和镀镍15% SiC_P/6063Al复合材料之间进行真空钎焊.采用SEM，XRD对接头界面微观组织和成分进行分析.结果表明，在钎焊过程中，钎料与镍层发生界面反应生成了连续的扇贝状金属间化合物（IMC），其具体成分为（Cu，Ni）₆Sn₅；该IMC层排列紧凑，生长方向都垂直于界面指向钎料的内部；在钎焊过程中，IMC的生长分为生长速率较快和生长速率较缓慢两个阶段.在270℃，钎焊时间由10 min延长至40 min时，界面IMC层扇贝状形貌不变，晶粒尺寸变大；IMC层厚度增加，但是其厚度增长速率逐渐降低；钎焊接头抗剪强度不断增大.

Effect of soldering time on interface IMC growth of nickel-plated SiCP/Al composites

SiC_p/6063Al composites containing high and low volume fraction SiC after electroless nickel plating were soldered by using Sn-3.0Ag-0.5Cu-3.0Bi solder in vacuum. The microstructure and components of the interface were studied by means of SEM and XRD. The results show that in the soldering process, the solder reacts with the nickel layer and continuous scalloped intermetallic compound forms at the interface and the IMC is (Cu, Ni)₆Sn₅. The IMC layer is arranged compact and its growth direction perpendicular to the interface point to solder. In the soldering process, the growth of IMC can be divided into a faster growth rate stage and a slower growth rate stage. At the soldering temperature of 270℃, when soldering time is extended from 10 min to 40 min, scallop-shaped morphology of IMC keeps unchanged, the grain of IMC becomes larger. Thickness of IMC layer increases, but its growth rate is gradually reduced with increasing soldering time. The shear strength of the soldered joint improves continuously.