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ZChSnSb11-6在镀锡合金钢表面扩散连接分析
引用本文:邹军涛,李思林,赵艳,梁淑华. ZChSnSb11-6在镀锡合金钢表面扩散连接分析[J]. 焊接学报, 2018, 39(7): 42-46. DOI: 10.12073/j.hjxb.2018390172
作者姓名:邹军涛  李思林  赵艳  梁淑华
作者单位:西安理工大学 陕西省电工材料与熔渗技术重点试验室, 西安 710048
基金项目:国家自然科学基金资助项目(51401162;U1502274);教育部高等学校特色专业建设点项目(TS12493);陕西省科技计划(2018ZDXM-GY-136;14JK1507;2015XT-16);陕西省重点学科建设资金资助
摘    要:在原子扩散理论分析基础上,通过热浸镀锡作为扩散过渡层的方法制备了高强界面的ZChSnSb11-6/30CrMnSi复合材料.采用扫描电子显微镜(SEM),能谱仪(EDS)表征了ZChSnSb11-6在热浸镀锌30CrMnSi钢表面形成的界面过渡区形貌及其元素分布,并对界面硬度和结合强度进行了表征.结果表明,通过热浸镀锡作为中间层的方法可以制备出巴氏合金/钢双金属复合材料;30CrMnSi钢基体与中间层金属锡形成一层互相扩散的过渡区,厚度随镀锡温度的升高而显著增加;过渡区硬度明显高于两侧基体;界面结合强度随镀锡温度的升高逐渐上升,在900℃时结合强度达到60.6 MPa.

关 键 词:巴氏合金  复合材料  界面  热浸镀
收稿时间:2017-05-08

Study on interface diffusion bonding of ZChSnSb11-6 alloy and tin plating steel
ZOU Juntao, LI Silin, ZHAO Yan, LIANG Shuhua. Study on interface diffusion bonding of ZChSnSb11-6 alloy and tin plating steel[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(7): 42-46. DOI: 10.12073/j.hjxb.2018390172
Authors:ZOU Juntao  LI Silin  ZHAO Yan  LIANG Shuhua
Affiliation:Key Laboratory of Electrical Material and Infiltration Technology, Xi'an University of Technology, Xi'an 710048, China
Abstract:In the paper, on the basis of the theory of atomic diffusion, ZChSnSb11-6/30CrMnSi bimetal composite material was prepared by means of hot dipping tin plating as intermediate transition layer. The transition zone morphology and element distribution of ZChSnSb11-6/30CrMnSi bimetallic material were characterized by a scanning electron microscope (SEM) equipped with an energy disperse spectroscopy (EDS). Also, the hardness and interface bonding strength were tested. The research results prove the functionality and availability of the method using the hot dipping tin to attach the ZChSnSb11-6 with 30CrMnSi. There is a transition area generated by the diffusion between the steel substrate and the middle layer tin, and the thickness of the transition area increases significantly with the increasing of tin plating temperature. Besides, the hardness of transition zone is significantly higher than both sides of the substrate. Interface bonding strength increased with the increasing of tin plating temperature, and peaks arrived to 60.6 MPa at 900℃.
Keywords:ZChSnSb11-6  composite material  interface  hot dipping
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