Sn-Zn-Bi-(P,Nd)无铅钎料的微观组织及性能

研究了复合加入P,Nd元素的Sn-8Zn-3Bi钎料的微观组织、力学性能、抗氧化性及润湿性.结果表明,单独加入元素P会导致Sn-8Zn-3Bi钎料组织中出现初生Zn相,而同时加入元素P和Nd不仅能够抑制初生Zn相的形成,钎料组织也能够得到细化,因此钎料的塑性提高,断后伸长率达到48%.P,Nd元素的复合添加能够在钎料表面形成稳定的扩散阻挡层,抑制P元素在长时间加热条件下的烧损,进一步降低表面的氧化速度.由于钎料的抗氧化性提高,Sn-8Zn-3Bi-0.1P-0.05Nd钎料呈现出更好的润湿性.

Microstructure and properties of Sn-Zn-Bi-(P,Nd) lead-free solders

Microstructure, mechanical properties, oxidation resistance and wettability of Sn-8Zn-3Bi lead-free solder doping with P and Nd were studied in this paper.Primary Zn phase was observed in the microstructure of Sn-8Zn-3Bi alloying with separate P element.By adding P together with Nd not only the formation of the primary Zn phase can be inhibited, the massive microstructure of the solder also can be refined.It was the reason that the solder plastic improved, and the elongation reached 48%.P element in solder melts was apt to loss in the process of long term heating.A diffusion barrier layer could form at the surface of the Sn-8Zn-3Bi solder by doping with P and Nd, which reduced the loss of P, and the oxidation rate decreased as well.With the improved oxidation resistance, the Sn-8Zn-3Bi-0.1P-0.05Nd solder showed high wetting performance.