| 微连接和纳连接的研究新进展 |
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| 引用本文： | 邹贵生,闫剑锋,母凤文,吴爱萍,ZHOU Y Norman.微连接和纳连接的研究新进展[J].焊接学报,2011,32(4):107-112. |
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| 作者姓名： | 邹贵生 闫剑锋 母凤文 吴爱萍 ZHOU Y Norman |
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| 作者单位： | 1. 清华大学机械工程系和教育部先进成形制造重点实验室,北京,100084
2. Department of Mechanical and Mechatronics Engineering,University of Waterloo,Ontario N2L 3G1,Canada |
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| 基金项目： | 国家自然科学基金面上和重点项目，清华大学自主科研计划项目 |
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| 摘 要： | 微连接和纳连接是微/纳级机械、电子和医疗等器件或系统结构制造的关键技术,综述其最新研究进展.针对电子封装,阐述无铅钎料的研制现状和铜引线键合新技术.针对医疗器件和铋系超导带材,分别介绍细丝、薄片连接的典型方法如微电阻焊、微激光焊和钎焊以及一步法扩散焊.对于碳纳米管,介绍电子束辐照连接、双壁碳纳米管薄膜卷覆法连接及钎焊....
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| 关 键 词： | 微连接 纳连接 医疗器件 电子器件 纳米颗粒 |
| 收稿时间： | 2010/12/30 0:00:00 |
Recent progress in microjoining and nanojoining |
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| ZOU Guisheng,YAN Jianfeng,MU Fengwen,WU Aiping and ZHOU Y Norman.Recent progress in microjoining and nanojoining[J].Transactions of The China Welding Institution,2011,32(4):107-112. |
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| Authors: | ZOU Guisheng YAN Jianfeng MU Fengwen WU Aiping and ZHOU Y Norman |
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| Affiliation: | Department of Mechanical Engineering, Key Laboratory for Advanced Materials Processing Technology, Ministry of Education of China, Tsinghua University, Beijing 100084, China,Department of Mechanical Engineering, Key Laboratory for Advanced Materials Processing Technology, Ministry of Education of China, Tsinghua University, Beijing 100084, China,Department of Mechanical Engineering, Key Laboratory for Advanced Materials Processing Technology, Ministry of Education of China, Tsinghua University, Beijing 100084, China,Department of Mechanical Engineering, Key Laboratory for Advanced Materials Processing Technology, Ministry of Education of China, Tsinghua University, Beijing 100084, China and Department of Mechanical and Mechatronics Engineering, University of Waterloo, Ontario N2L 3G1, Canada |
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| Abstract: | Micro-joining and nano-joining have been identified as the key technologies in the construct fabrication such as micro-and nano-mechanical,electronic and medical devices and systems,and their recent progresses are briefly reviewed in this article.For electronic packaging applications,the developed lead-free solders and the two-step loading procedure accompanied with a superimposed ultrasound for copper-wire-bonding were expounded.Typical joining methods including resistance micro-welding,laser micro-welding and brazing for similar and dissimilar wires or pieces used for medical devices were discussed,as well as one-step diffusion bonding with pressing at high temperature for Bi-Sr-Ca-Cu-O superconductive leads.Joining technologies were also introduced,including electron beam irradiating welding,strand wrapping bonding with Double-walled Carbon Nanotube Strands(DWNT) film and brazing,the welding technologies of metal nanoparticles realized through laser irradiation,and the novel process of low-temperature sintering bonding by using Ag,Cu,Ag-Cu and Ag2O micro/nano-particle pastes for electronic packaging applications.Based on the existing and new processes,the challenges and outlooks in micro-and nano-joining were pointed out. |
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| Keywords: | microjoining nanojoining medical device electronics nanoparticle |
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