焊后热处理对钛/铝FSB接头组织及性能的影响

研究了6082铝合金和TC4钛合金分别添加钎料锌和镍下的搅拌摩擦钎焊(FSB)搭接接头微观组织及焊后热处理后接头界面金属间化合物(IMC)的生成种类和先后顺序以及生长动力学模型。研究表明:添加钎料锌时,界面金属间化合物主要由AlZn、TiAl、TiAl2、TiAl3组成,先后顺序为TiAl2→TiAl3→TiAl→AlZn,并获得了界面IMC层的生长动力学模型为;添加钎料镍时,界面金属间化合物层主要由TiNi、Al3Ni2、Ti3Al和TiAl组成,先后顺序为776 K以下,Ti-Ni-Al焊接界面金属间化合物形成的顺序是Al3Ni2→TiNi→TiAl→Ti3Al,776 K以上时生成顺序为Al3Ni2→TiNi→Ti3Al→TiAl,并获得了界面IMC层的生长动力学模型。界面IMC层的厚度均随着温度的提高或保温时间的延长而增加。添加锌的接头的剪切强度由未热处理时的154 MPa提高到194 MPa,而添加钎料镍的接头由142 MPa提高至166 MPa。

Effect of annealing treatment on interfacial microstructure and properties of Ti/Al FSB joint

The paper investigated the microstructure of the friction stir brazing dissimilar joints between 6082 aluminum alloy and TC4 titanium alloy by adding the filler Zn and Ni and the type and formation sequence and kinetic growth model of IMCs during post welding annealing treatment.The results show that the IMC layer consisted of AlZn,TiAl,TiAl2 and TiAl3 and the formation sequence is TiAl2→TiAl3→TiAl→AlZn on the filler Zn.The IMC layer consisted TiNi,Al3Ni2,Ti3Al and TiAl and the formation sequence is Al3Ni2→TiNi→TiAl→Ti3Al below 776 K and Al3Ni2→TiNi→TiAl→Ti3Al above 776 K on the filler Ni.The growth kinetic models are obtained.The thickness of the IMC layer increases with increasing the annealing temperature and/or holding time.The shearing strength increases from 154MPa during unheat-treatment to 194 MPa by adding filler Zn,and from 142 MPa to 166 MPa by adding filler Ni.