| FeCl_3溶液中影响Cu蚀刻速度的因素 |
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| 引用本文： | 蔡坚,马莒生,汪刚强,唐祥云.FeCl_3溶液中影响Cu蚀刻速度的因素[J].中国有色金属学报,1998(Z1). |
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| 作者姓名： | 蔡坚 马莒生 汪刚强 唐祥云 |
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| 作者单位： | 清华大学材料科学与工程系 |
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| 摘 要： | 采用喷蚀的方法，研究了Ｃｕ在２．５ｍｏｌ／ＬＦｅＣｌ３溶液中影响蚀刻速度的几个因素。用ＸＲＤ方法分析了Ｃｕ蚀刻表面的成分，证实了蚀刻过程中ＣｕＣｌ钝化膜的形成；研究了蚀刻速度随蚀刻时间的变化规律，给出了初步的解释；同时研究了蚀刻液中不同氯化物添加剂对蚀刻速度的影响，结果表明阴离子不是影响蚀刻速度的唯一因素，不能排除阳离子的影响；同时对蚀刻液的溶铜能力及失效蚀刻液的再生进行了初步的研究。
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| 关 键 词： | 蚀刻速度 钝化膜 再生 |
EFFECTS ON ETCHING RATES OF Cu IN FeCl 3 SOLUTION |
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| Cai Jian,Ma Jusheng,Wang Gangqiang and Tang Xiangyun.EFFECTS ON ETCHING RATES OF Cu IN FeCl 3 SOLUTION[J].The Chinese Journal of Nonferrous Metals,1998(Z1). |
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| Authors: | Cai Jian Ma Jusheng Wang Gangqiang and Tang Xiangyun |
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| Affiliation: | Cai Jian,Ma Jusheng,Wang Gangqiang and Tang Xiangyun Department of Materials Science and Engineering,Tsinghua University,Beijing 100084,P. R. China |
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| Abstract: | Several factors on etching rates of Cu in FeCl 3 etchant were studied with a spray etching apparatus. The etching surfaces of Cu were analyzed by XRD and the results show that there is a CuCl passitivation film on etching surface. A brief explanation was offered after the relationship between etching rate and etching time being investigated. It indicates that K ion influences the etching rate obviously as the effects of different chlorides on etching rates have been studied. Additionally, the quantity of copper dissolving in FeCl 3 etchant and regeneration of spent etchants were also investigated. |
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| Keywords: | etching rate passivation film regeneration |
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