| 不同粒径核壳结构聚苯乙烯(PS)-CeO2复合磨料的制备、表征及其化学机械抛光性能 |
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| 引用本文： | 陆锦霞,陈志刚,隆仁伟. 不同粒径核壳结构聚苯乙烯(PS)-CeO2复合磨料的制备、表征及其化学机械抛光性能[J]. 中国有色金属学报, 2011, 0(7) |
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| 作者姓名： | 陆锦霞 陈志刚 隆仁伟 |
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| 作者单位： | 1. 常州大学材料科学与工程学院,常州,213164
2. 常州大学材料科学与工程学院,常州213164;苏州科技学院化学与生物工程学院,苏州215011 |
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| 基金项目： | 江苏省工业支撑计划项目，常州市工业科技攻关项目 |
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| 摘 要： | 以无皂乳液聚合法制备的不同粒径聚苯乙烯(Ploystrene,PS)微球为内核,以硝酸铈和六亚甲基四胺为原料,采用液相工艺制备具有核壳结构的PS-CeO2复合微球.利用X射线衍射仪(XRD)、透射电子显微镜(TEM)、场发射扫描电镜(FESEM)、傅里叶转换红外光谱仪(FT-IR)和热重分析仪(TGA)等对样品的成分、物相结构、形貌、粒径以及团聚情况进行表征.将所制备的PS-CeO2复合微球作为磨料用于二氧化硅介质层的化学机械抛光,用原子力显微镜(AFM)观察抛光表面的微观形貌,测量表面粗糙度.结果表明:所制备的3种PS微球呈单分散规则球形,粒径分别约为120、170和240 nm;3种PS-CeO2复合微球具有核壳结构,粒径分别约为140、190和260nm,CeO2壳厚约为10 nm.随着PS-CeO2复合磨料粒径的减小,抛光表面粗糙度随之降低,经样品F1抛光后表面在10 μm× 10 μm面积范围内粗糙度的平均值（Ra）及其均方根（Rms）分别为0.372和0.470 nm.
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| 关 键 词： | PS-CeO2复合磨料 核壳结构：化学机械抛光 |
Preparation, characterization and performance of core-shell PS-CeO2 composite abrasives with different particle sizes |
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| LU Jin-xia,CHEN Zhi-gang,LONG Ren-wei. Preparation, characterization and performance of core-shell PS-CeO2 composite abrasives with different particle sizes[J]. The Chinese Journal of Nonferrous Metals, 2011, 0(7) |
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| Authors: | LU Jin-xia CHEN Zhi-gang LONG Ren-wei |
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| Affiliation: | LU Jin-xia1,CHEN Zhi-gang2,LONG Ren-wei1 (1.School of Materials Science and Engineering,Changzhou University,Changzhou 213164,China,2.School of Chemistry and Biological Engineering,Suzhou University of Science and Technology,Suzhou 215011,China) |
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| Abstract: | Polystyrene(PS) microspheres were prepared by soap-free emulsion polymerization method.Core-shell structured PS-CeO2 composite microspheres were synthesized by liquid phase process using cerium nitrate and hexamethylene tetramine as raw materials.The composition,phase structure,morphology,grain size and agglomeration of the as-prepared composite microspheres were characterized by XRD,TEM,FESEM,FT-IR and TGA.The as-prepared composite microspheres were collocated into polishing abrasives for chemical mechanic... |
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| Keywords: | PS-CeO2 composite abrasives core-shell structure chemical mechanical polishing(CMP) |
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