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无铅焊料在NaCl-Na_2SO_4-Na_2CO_3模拟土壤溶液中的腐蚀浸出行为
引用本文:王丽华,程从前,杨芬,赵杰. 无铅焊料在NaCl-Na_2SO_4-Na_2CO_3模拟土壤溶液中的腐蚀浸出行为[J]. 中国腐蚀与防护学报, 2011, 0(5)
作者姓名:王丽华  程从前  杨芬  赵杰
作者单位:大连理工大学材料学院;
基金项目:国家科技基础条件平台建设项目(2005DKA10400-Z23); 中央高校基本科研业务专项资助
摘    要:研究了Sn-3.5Ag-0.75Cu和Sn-0.75Cu焊料合金在NaCl-Na_2SO_4-Na_2CO_3模拟土壤溶液中的腐蚀浸出行为,并与Sn-37Pb焊料合金的腐蚀浸出行为对比分析。研究表明,这3种焊料合金中Sn的浸出量随时间的延长趋于平缓,且Sn-0.75Cu焊料合金中Sn的浸出量最高,添加Ag元素后明显抑制了Sn-3·5Ag-0·75Cu焊料合金中Sn的浸出;Ag,Cu,Pb的浸出量随时间的延长呈线性增加,且Ag,Cu的浸出量较少。3种焊料合金浸出后表面产物层较厚,主要由Sn_4(OH)_6Cl_2和SnO组成,其中Sn-0.75Cu焊料合金的表面产物层有裂纹和孔洞,Sn-3.5Ag-0.75Cu焊料合金的表面产物相对致密,而Sn-37Pb焊料合金的表面产物局部出现剥落现象。这3种焊料合金浸出动力学行为存在差异,主要与表面产物的相组成和形貌有关。

关 键 词:无铅焊料  NaCl-Na_2SO_4-Na_2CO_3混合溶液  浸出动力学  

LEACHING BEHAVIOR OF LEAD-FREE SOLDERS IN A NaCl-Na_2SO_4-Na_2CO_3 MIXED SOLUTION AS SIMULATED SOIL
WANG Lihua,CHENG Congqian,YANG Fen,ZHAO Jie School of Materials Science , Engineering,Dalian University of Technology,Dalian. LEACHING BEHAVIOR OF LEAD-FREE SOLDERS IN A NaCl-Na_2SO_4-Na_2CO_3 MIXED SOLUTION AS SIMULATED SOIL[J]. Journal of Chinese Society For Corrosion and Protection, 2011, 0(5)
Authors:WANG Lihua  CHENG Congqian  YANG Fen  ZHAO Jie School of Materials Science    Engineering  Dalian University of Technology  Dalian
Affiliation:WANG Lihua,CHENG Congqian,YANG Fen,ZHAO Jie School of Materials Science and Engineering,Dalian University of Technology,Dalian 116085
Abstract:Leaching behavior of Sn-3.5Ag-0.75Cu and Sn-0.75Cu lead-free solder alloys in a NaCl-Na_2SO_4-Na_2CO_3 mixed solution as simulated soil was investigated and compared with that of Sn-37Pb alloy.The results showed that leaching amount of Sn from the three solders increased with reaction period.The most leaching amount of Sn was found for Sn-0.7Cu solder alloy.However,Sn leached from Sn-3.5Ag-0.75Cu solder alloy was depressed by adding Ag element.The leaching amount of Ag,Cu and Pb elements also increased line...
Keywords:lead-free solder alloys  NaCl-Na_2SO_4-Na_2CO_3 mixed solution  leaching kinetics  morphology  phase composition  
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