静磁场下硫酸盐还原菌对HSn70-1铜合金的腐蚀行为

采用失重法、电化学测量和表面分析技术研究了有、无静磁场环境下,在含有硫酸盐还原菌(SRB)的培养基中HSn70-1铜合金的腐蚀行为。结果表明:SRB条件下,HSn70-1铜合金腐蚀质量损失最大,无磁场下的腐蚀电流密度远大于有磁场条件下的,磁场的加入可以有效地减缓HSn70-1铜合金的腐蚀。SEM,EDS,XRD和XPS实验分析表明,静磁场下HSn70-1铜合金表面腐蚀产物膜均匀致密,腐蚀产物为金属硫化物,Cu的化合价以一价(Cu+)为主;而无磁场时腐蚀产物疏松,腐蚀产物硫化物中Cu主要为二价(Cu2+)。静磁场条件下所形成的致密的Cu2S腐蚀产物层阻碍腐蚀的发生,有效地减缓了HSn70-1铜合金的腐蚀。

Corrosion Behavior of HSn70-1 Copper Alloy in SRB Containing Medium in Atatic Magnetic Field

The corrosion behavior of HSn70-1copper alloy in sulfate-reducing bacteria (SRB) containing medium in the absence and presence of a static magnetic field (SMF) respectively was investigated by means of weight loss method, electrochemical measurement and surface analysis method. The results showed that the corrosion weight loss and the corrosion current density of the alloy was higher in the inoculated SRB medium in the absence of SMF rather than those in the presence of SMF. Thus the presence of a SMF can suppress effectively the corrosion of copper alloy. The results of SEM/EDS, XRD and XPS analysis showed that in the inoculated SRB medium a compact and uniform film formed on the surface of copper alloy in the presence of SMF, the corrosion products were cuprous sulfide; however in the absence of SMF the formed corrosion product on the alloy was loose and consisted of cupric sulfide. In fact the compact corrosion scale of cuprous sulfide could effectively suppress the SRB induced corrosion of copper alloy.