Effect of immersion Ni plating on interface microstructure and mechanical properties of Al/Cu bimetal |
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Authors: | Jia-lei ZHAO Jin-chuan JIE Fei CHEN Hang CHEN Ting-ju LI Zhi-qiang CAO |
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Affiliation: | School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China |
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Abstract: | A nickel-based coating was deposited on the pure Al substrate by immersion plating, and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450–550 °C. The interface microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy (SEM) and X-ray diffraction (XRD). The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests. The results show that the Ni interlayer can effectively eliminate the formation of Al-Cu intermetallic compounds. The Al/Ni interface consists of the Al3Ni and Al3Ni2 phases, while it is Ni-Cu solid solution at the Ni/Cu interface. The tensile shear strength of the joints is improved by the addition of Ni interlayer. The joint with Ni interlayer annealed at 500 °C exhibits a maximum value of tensile shear strength of 34.7 MPa. |
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Keywords: | Al/Cu bimetal immersion Ni plating interface diffusion bonding intermetallics |
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