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金刚石表面化学镀铜工艺的优化(英文)
引用本文:A.R.NIAZI,李树奎,王迎春,刘金旭,呼陟宇,ZahidUSMAN.金刚石表面化学镀铜工艺的优化(英文)[J].中国有色金属学会会刊,2014,24(1):136-145.
作者姓名:A.R.NIAZI  李树奎  王迎春  刘金旭  呼陟宇  ZahidUSMAN
作者单位:北京理工大学 材料学院,北京100081
基金项目:Project (9140A12060110BQ03) supported by the National Key Laboratory of Science and Technology on Materials under Shock and Impact, China
摘    要:研究预镀1%铬金刚石颗粒表面化学镀铜的预处理工艺、镀液成分和工艺参数对表面形貌、沉积效率、镀层均匀性等的影响,优化出最佳工艺参数。结果表明,采用20%NaOH溶液处理30 min后,再在SnCl2溶液中进行5 min敏化和在PbCl2溶液中进行20 min活化,能提高预镀1%铬金刚石颗粒表面镀铜质量,并获得较高的铜沉积率。化学镀铜最佳工艺条件为:16 g/L CuSO4·5H2O,35 mL/L甲醛,23 g/L酒石酸钾钠,温度60°C,pH=13,辅助超声加(350±15)r/min的机械搅拌。采用此工艺在预镀1%铬金刚石颗粒表面获得了厚度均匀的纯铜层。

关 键 词:化学镀铜  预镀铬金刚石  工艺优化
收稿时间:1 November 2012

Parameters optimization of electroless deposition of Cu on Cr-coated diamond
A.R. NIAZI,Shu-kui LI,Ying-chun WANG,Jin-xu LIU,Zhi-yu HU,Zahid USMAN.Parameters optimization of electroless deposition of Cu on Cr-coated diamond[J].Transactions of Nonferrous Metals Society of China,2014,24(1):136-145.
Authors:AR NIAZI  Shu-kui LI  Ying-chun WANG  Jin-xu LIU  Zhi-yu HU  Zahid USMAN
Affiliation:A.R.NIAZI, Shu-kui LI, Ying-chun WANG, Jin-xu LIU, Zhi-yu HU, Zahid USMAN (School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, China)
Abstract:Electroless copper plating on diamond particles precoated with 1%Cr was carried out to evaluate the effects of various experimental parameters on coating quality and deposition rate to obtain the optimized reaction parameters. The formulated samples under optimized parameters were characterized by X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectron spectra and optical microscopy. The best parameters, where uniform and maximum coating thickness was achieved, are etching with 20%NaOH for 30 min, sensitization and activation with SnCl2 and PdCl2 for 5 and 20 min, respectively. The composition of the copper solution bath was 16 g/L CuSO4·5H2O, 35 mL/L formaldehyde (HCHO), 23 g/L KNaC4H4O6 at 60 ℃, pH=13 and stirring at (350±15) r/min under ultrasonication.
Keywords:electroless copper plating  Cr-coated diamond  parameter optimization
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