| Effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder |
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| 作者姓名： | 薛松柏 禹胜林 王旭艳 刘琳 胡永芳 姚立华 |
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| 作者单位： | [1]College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China [2]14th Research Institute, China Eletronics Technology Group Corporation, Nanjing 210013, China |
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| 摘 要： | Several important properties of the micron-powdered Sn-Ag-Cu-Ce solder, including the spreadability, spreading ratio, wetting time, and melting point, were investigated for verifying the effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder. The solidus and the liquidus of the micron-powdered Sn-Ag-Cu-Ce solder are 193.6℃ and 218.4℃, respectively, about 28℃ and 3℃ lower than the melting point of the block Sn-Ag-Cu solder, which reminds the existence of the surface effect of the micron-powdered solder. By adding Ce into Sn-Ag-Cu alloy, its wetting time on pure copper can be obviously decreased. For the Sn-Ag-Cu-0.03?, the soldering temperature is 250℃, and the wetting time on pure copper is close to 1s, with the soldering temperature approaching to 260℃, the wetting time is dropped to 0.8s, which is close to the wetting time, 0.68s, of Sn-Pb solder at 235℃.
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| 关 键 词： | Sn-Ag-Cu合金 润湿时间 可焊性 固相线 液相线 焊料 |
| 文章编号： | 1003-6326（2005）06-1285-05 |
| 收稿时间： | 2005-07-05 |
| 修稿时间： | 2005-10-17 |
Effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder |
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| XUE Song-bai,YU Sheng-lin,WANG Xu-yan,LIU lin,HU Yong-fang,YAO Li-hua.Effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder[J].Transactions of Nonferrous Metals Society of China,2005,15(6):1285-1289. |
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| Authors: | XUE Song-bai YU Sheng-lin WANG Xu-yan LIU lin HU Yong-fang YAO Li-hua |
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| Abstract: | |
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| Keywords: | lead-free solder Sn-Ag-Cu-Ce alloy wetting time solidus liquidus |
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