| 基于MPI底盖成型工艺参数优化 |
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| 引用本文： | 郑晓华,曾令琴.基于MPI底盖成型工艺参数优化[J].模具工业,2009,35(7):22-25. |
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| 作者姓名： | 郑晓华 曾令琴 |
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| 作者单位： | 太原科技大学,材料学院,山西,太原,030024 |
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| 摘 要： | 针对产品在实际生产中出现的表面流纹和缩痕情况,通过Moldflow软件对塑料底盖注射过程中的填充、流动情况进行数值模拟,分析熔接痕和收缩等缺陷,优化浇口数量、位置和保压压力、保压时间以减少产品的缺陷,并将分析结果用于注射过程中工艺参数的设定,解决了实际问题。
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| 关 键 词： | Moldflow 表面流纹 缩痕 工艺参数 优化设计 |
MPI-based parameter optimization of molding process for bottom cover |
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| ZHENG Xiao-hua,ZENG Ling-qin.MPI-based parameter optimization of molding process for bottom cover[J].Die & Mould Industry,2009,35(7):22-25. |
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| Authors: | ZHENG Xiao-hua ZENG Ling-qin |
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| Affiliation: | (School of Materials Science and Engineering, Taiyuan University of Science and Technology, Taiyuan, Shanxi 030024, China) |
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| Abstract: | In order to avoid surface flow marks and shrink marks in a bottom cover, Moldilow software was used to simulate the melt-filling process in the mould. The defects like weld lines and shrink marks, were analyzed. By MPI, we optimized the gate number, location, the holding pressure and time, so as to reduce the quality defects and to provide information for setting practical process parameters, thus to solve the problems in the productions. |
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| Keywords: | Moldflow |
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