| Effect of Ga on microstructure and properties of Sn-Zn-Bi solder for photovoltaic ribbon |
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| 作者姓名： | 张敏 许桓瑞 王刚 朱子越 |
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| 作者单位： | School of Materials, Xi′an University of Technology, Xi′an 710048, China |
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| 摘 要： | In this study, SEM, EDS, XRD and other test methods were used to study the effects of different Ga contents(0～2 wt.%) on microstructure, electrical conductivity, spreading area and mechanical properties of Sn-9 Zn-3 Bi solder. The results revealed that the microstructure of Sn-Zn-Bi-Ga solder alloy was mainly composed of β-Sn, Zn-rich, Bi-rich phase and Sn-Zn eutectic structure. The Ga can significantly improve the wettability of Sn-Zn-Bi on the pure copper, the maximum wetting area was 105.3 mm2. With the increase of the Ga content the melting point of the solders decreased from 195 ℃ to 177 ℃. In addition, the Ga element can increase the oxidation resistance of solder. Its conductivity showed a decreasing trend with the gradual increase of the Ga content. With the increased of the Ga content the IMC(Intermetallic Compound) of Sn-Zn-Bi-x Ga/Cu is only Cu5 Zn8 and its thickness decreased remarkably.
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| 关 键 词： | Sn-Zn-Bi-Ga solder|microstructure|wetting area|intermetallic compound |
| 收稿时间： | 2019/9/17 0:00:00 |
Effect of Ga on microstructure and properties of Sn-Zn-Bi solder for photovoltaic ribbon |
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| Min Zhang,Huanrui Xu,Gang Wang,Ziyue Zhu.Effect of Ga on microstructure and properties of Sn-Zn-Bi solder for photovoltaic ribbon[J].China Welding,2019,28(4):1-7. |
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| Authors: | Min Zhang Huanrui Xu Gang Wang Ziyue Zhu |
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| Abstract: | |
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| Keywords: | Sn-Zn-Bi-Ga solder|microstructure|wetting area|intermetallic compound |
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