| Study on interfacial structure and strength of Si_3N_4/Ti/Cu/Ti/Si_3N_4 PTLP bonding |
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| 引用本文： | 邹家生,蒋志国,许志荣,陈广.Study on interfacial structure and strength of Si_3N_4/Ti/Cu/Ti/Si_3N_4 PTLP bonding[J].中国焊接,2006(1). |
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| 作者姓名： | 邹家生 蒋志国 许志荣 陈广 |
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| 作者单位： | Department of Materials Science and Engineering Nanjing University of Science and Technology，Nanjing，210094，Jiangsu Provincial Key Lab of Advanced Welding Technology，Jiangsu University of Science and Technology，Zhenjiang，212003，Jiangsu Provincial Key Lab of Advanced Welding Technology，Jiangsu University of Science and Technology，Zhenjiang，212003，Jiangsu Provincial Key Lab of Advanced Welding Technology，Jiangsu University of Science and Technology，Zhenjiang，212003，Department of Materials Science and Engineering，Nanjing University of Science and Technology，Nanjing，210094 |
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| 基金项目： | ThisworkwasfinanciallysupportedbyNationalScienceFundofJiangsuProvince(No.BK2003045)andNationalScienceFundofJiangsuCollegesandUniversities(No.03KJB430006). |
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| 摘 要： | 0IntroductionRecently,the development of bonding technique ofhigh temperature structure ceramic Si3N4becomes a hottopic in the field of ceramic bonding1].Partial transientliquid phase bonding(PTLP)has been applied in the fieldof high temperature ceramic bonding and made some pro-gress.The selection of interlayer materials is key to PTLPbonding.Since Bender discovered that Ag-based brazingmaterial including Ti could wet ceramic in1954,morestudies have shown that Ti has good wetting prope…
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