| Study on interracial structure and strength of Si3N4/Ti/Cu/Ti/Si3S4 PTLP bonding |
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| 作者姓名： | 邹家生 蒋志国 许志荣 陈广 |
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| 作者单位： | [1]Department of Materials Science and Engineering, Nanjing University of Science and Technology, Nanjing, 210094. [2]Jiangsu Provincial Key Lab of Advanced Welding Technology, Jiangsu University of Science and Technology, Zhenjiang, 212003. |
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| 基金项目： | This work was financially supported by National Science Fund of Jiangsu Province （ No. BK2003045 ） and National Science Fund of Jiangsu Colleges and Universities（ No. 03KJB430006）. |
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| 摘 要： | Partial transient liquid-phase bonding （PTLP bonding） of Si3N4 ceramic with Ti/Cu/Ti multi-interlayer is performed with changing the thickness of Ti foil. The influence of Ti foil thickness on interface structure and joint strength was discussed. The joint interface structures are investigated by scanning electron microscope （SEM） and energy dispersion spectroscopy（EDS）. The results show that the maximum joint strength of 210 MPa is obtained at room temperature in the experiments. When joining temperature and time are not changed and the process of isothermal solidification is sufficient , interface structure, reaction layer thickness and isothermal solidification thickness change with the thickness of Ti foil.
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| 关 键 词： | PTLP 焊接 陶瓷-金属连接 氮化硅 钛 界面结构 |
Study on interracial structure and strength of Si3N4/Ti/Cu/Ti/Si3S4 PTLP bonding |
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| Zou GuSheng;Jiang ZhiGuo;Xu ZhiRong;Chen Guang.Study on interracial structure and strength of Si3N4/Ti/Cu/Ti/Si3S4 PTLP bonding[J].China Welding,2006,15(1):11-15. |
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| Authors: | Zou GuSheng;Jiang ZhiGuo;Xu ZhiRong;Chen Guang |
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| Abstract: | |
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| Keywords: | partial transient liquid-phase bonding silicon nitride Ti foil thickness interfacial structure bonding strength |
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